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| موضوع: كتاب Additive Manufacturing Processes الخميس 29 أبريل 2021, 1:55 am | |
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أخوانى فى الله أحضرت لكم كتاب Additive Manufacturing Processes Sanjay Kumar
و المحتوى كما يلي :
Contents 1 Introduction . 1 1.1 Introduction . 1 1.2 Definition of a Process and Additive Manufacturing 3 1.3 Steps in Additive Layer Manufacturing 4 1.4 Additive Layer Manufacturing and Additive Manufacturing 5 1.5 Oldest Evidence of Additive Layer Manufacturing . 6 1.6 Comparison Between Machining and Additive Manufacturing . 7 1.6.1 Approach . 7 1.6.2 Generation of Waste . 8 1.6.3 Material Properties 9 1.7 Why ‘Complexity in Additive Manufacturing Is Free’ Is a Myth . 9 1.8 Summary of Additive Manufacturing Processes . 11 1.9 AM Processes for Fabricating Parts . 14 1.9.1 Metallic Parts 14 1.9.2 Polymer Parts 14 1.9.3 Ceramic Parts 15 1.9.4 Composite Parts 15 1.9.5 Functionally Graded Materials 16 References . 16 2 Classification 21 2.1 Introduction . 21 2.2 Difference in Additive Manufacturing Processes . 21 2.2.1 Materials . 22 2.2.2 Agent for Joining Materials . 23 2.2.3 Form of Feedstock 24 2.2.4 Conveyance of Feedstock 25x 2.3 Classification by ASTM 26 2.3.1 Complication with ASTM Classification . 27 2.4 Attempt to Classify on the Basis of Materials . 28 2.5 Attempt to Classify on the Basis of Agents for Joining Materials . 29 2.6 Attempt to Classify on the Basis of Form of Feedstock . 29 2.7 Attempt to Classify on the Basis of Conveyance of Feedstock . 30 2.7.1 No Feeding Category 30 2.7.2 Feeding Category . 31 2.8 Difference Between Solid Deposition Process and Liquid Deposition Process 34 2.9 Classification of AM 36 References . 39 3 Laser Powder Bed Fusion 41 3.1 Powder Bed Process . 41 3.1.1 Classification 42 3.1.2 Description of Classification 43 3.1.3 Role of Heat . 43 3.2 Laser Powder Bed Fusion 44 3.2.1 Why Selective Laser Sintering Is a Misnomer . 44 3.2.2 Selective Laser Sintering . 45 3.2.3 Selective Laser Melting 46 3.3 Process Parameters 46 3.3.1 Scan Spacing 48 3.3.2 Scan Speed 48 3.3.3 Layer Thickness 49 3.4 Why There Are No Four Binding Mechanisms 50 3.4.1 Liquid Phase Sintering . 51 3.4.2 Full Melting . 52 3.4.3 Why Solid State Sintering Is Not a Binding Mechanism 52 3.4.4 Why Chemical-Induced Binding Is Not a Binding Mechanism 54 3.5 Methods for Increasing Fabrication Rate . 54 3.5.1 Increasing Layer Thickness . 55 3.5.2 Dividing the Processing Area 55 3.5.3 Optimizing the Process as per the Need . 56 3.5.4 Changing the Orientation of Design to Be Fabricated . 57 3.5.5 Increasing Scan Speed . 58 3.5.6 Adopting Linewise and Areawise Scanning 59 3.6 Repair in Laser Powder Bed Fusion 60 References . 62 Contentsxi 4 Electron Beam Powder Bed Fusion 65 4.1 Process Description . 65 4.1.1 Beam Generation . 66 4.1.2 Beam Manipulation . 67 4.1.3 Vacuum Chamber . 72 4.1.4 Powder Bed Processing 73 4.2 Difference from Selective Laser Melting . 74 4.2.1 Powder . 74 4.2.2 Beam 75 4.2.3 Beam-Powder Interaction 75 4.2.4 Parameter . 76 4.2.5 Implication of Vacuum . 77 4.2.6 Scanning 77 References . 78 5 Other Powder Bed Processes . 79 5.1 Introduction . 79 5.2 Non-beam Based Powder Bed Fusion . 80 5.2.1 Heater Based Sintering 80 5.2.2 Localized Microwave Heating Based AM 81 5.3 High Speed Sintering 82 5.3.1 Energy-Efficiency of High Speed Sintering . 84 5.4 Linewise, Pointwise, Areawise Scanning 84 5.4.1 Linewise Scanning 84 5.4.2 Pointwise Scanning . 85 5.4.3 Areawise Scanning 85 5.4.4 Basic Difference Between the Three Types of Scanning . 87 5.5 Binder Jet Three-Dimensional Printing 88 5.5.1 Role of Binder . 88 References . 91 6 Beam Based Solid Deposition Process 93 6.1 Introduction . 93 6.2 Laser Solid Deposition Process 94 6.2.1 Types of Powder Deposition 95 6.2.2 Laser-Powder Interaction . 97 6.3 Repair in Laser Solid Deposition Process 101 6.4 Electron Beam Additive Manufacturing . 102 6.5 Difference Between Powder and Wire as Feedstock 103 6.5.1 Cost . 103 6.5.2 Availability 103 6.5.3 Material Efficiency 104 6.5.4 Processing in Vacuum . 104 6.5.5 Oxidation . 104 Contentsxii 6.5.6 Effect on Process . 105 6.5.7 Processing an Inaccessible Area . 106 References . 108 7 Other Solid Deposition Processes . 111 7.1 Introduction . 111 7.2 Friction Based Solid Deposition Process . 112 7.2.1 Additive Friction Stir Deposition . 113 7.2.2 Friction Surfacing Based Additive Manufacturing (FSBAM) . 114 7.3 Cold Spray Additive Manufacturing 116 7.3.1 How Cold Spray Is Generated . 117 7.4 Arc Welding Based Additive Manufacturing 119 7.4.1 What Is Arc . 119 7.4.2 Gas Tungsten Arc Welding (GTAW) Based AM . 122 7.4.3 Gas Metal Arc Welding (GMAW) Based AM . 124 7.5 Extrusion Based Additive Manufacturing 126 7.5.1 Feedstock Type in Extrusion Based AM . 127 7.6 Comparison Between Friction Based SDP and Fusion Based SDP 128 References . 129 8 Liquid Based Additive Layer Manufacturing . 131 8.1 Introduction . 131 8.2 Photopolymer Bed Process . 132 8.3 Why Stereolithography Is Not Stereolithography 134 8.4 Liquid Deposition Process 135 8.4.1 Water Deposition . 137 8.5 Slurry Based Process 138 8.5.1 Slurry Bed Process 139 8.5.2 Binding Methods in Slurry Bed Process . 140 8.5.3 Slurry Deposition Process 141 8.6 Four Dimensional Printing 142 References . 143 9 Air and Ion Deposition Processes . 147 9.1 Aerosol Jetting . 147 9.2 Ionic Solution Based Additive Manufacturing . 150 9.2.1 Electrolytic Solution Based Additive Manufacturing . 151 9.2.2 Colloidal Solution Based Additive Manufacturing . 155 References . 156 10 Additive Non-layer Manufacturing 159 10.1 Introduction . 159 10.2 Disadvantages of Additive Layer Manufacturing 160 10.2.1 Staircase Effect . 160 10.2.2 Need for Support Structure 162 Contentsxiii 10.2.3 Problem in Repair of an AM Part . 162 10.3 Additive Non-layer Manufacturing Process . 163 10.3.1 Layerless Fused Deposition Modeling 164 10.3.2 CNC Accumulation 165 10.3.3 Continuous Liquid Interface Production (CLIP) 166 10.3.4 Two-Photon Polymerization (2PP) 168 References . 170 11 Sheet Based Process 171 11.1 Introduction . 171 11.2 Ultrasonic Consolidation . 172 11.3 Laminated Object Manufacturing 173 11.3.1 Why Cut-Then-Bond Type Is a Subset of Bond-Then-Cut Type . 175 11.4 Why Sheet Based Process Is Not Additive Manufacturing . 177 11.5 Why Sheet Based Process Is Considered Additive Manufacturing . 178 11.6 Why Sheet Based Process Is Not a Hybrid Additive Manufacturing . 178 11.6.1 An Ideal Hybrid Additive Manufacturing Process . 179 11.6.2 Application of Hybrid Additive Manufacturing Criteria in Ultrasonic Consolidation . 180 11.7 Friction Stir Additive Manufacturing 181 11.8 Comparison Between FSAM and Powder Bed Fusion (PBF) . 183 11.8.1 Surface Finish 183 11.8.2 Micro-features 183 11.8.3 Feedstock 183 11.8.4 Part Properties 183 11.8.5 Part Fabrication . 184 References . 184 12 Future Additive Manufacturing Processes 187 12.1 Introduction . 187 12.2 Future Processes Based on Classification 188 12.2.1 Particle Bed Process 188 12.2.2 Non-photopolymer Bed Process 189 12.2.3 Sheet Bed Process . 189 12.3 Future Powder Bed Process . 193 12.3.1 Using Powder Deposition Tracks 193 12.3.2 Using Powder Hoppers . 196 12.4 Future Laser Solid Deposition Process 198 References . 202 Index. Index A Ablation, 1, 48, 77 Additive friction stir deposition (AFSD), 11, 22, 23, 29, 30, 33, 93, 112–114, 116 Additive layer manufacturing (ALM), 5, 6, 36, 37, 132, 160–165 Additive non-layer manufacturing (ANLM), 5, 36, 37, 132, 165 Aerosol jetting (AJ), 11, 14, 15, 22, 30, 147, 148 Areawise scanning, 85, 86, 88 ASTM, B Big area additive manufacturing (BAAM), 11, 15, 22, 27 Binder, 11, 13–15, 24, 25, 27, 29, 41–43, 51, 52, 59, 88–90, 139, 140, 142, 173 Binder jet three-dimensional printing (BJ3DP), 11, 22 Bottom-up approach, C CAD, 4, 5, 7, 41, 49, 61, 82, 94, 116, 140, 154, 155, 160, 172, 175, 176 Classification, 5, 27–30, 32, 36–38, 43, 188, 189 CNC, 1, 9, 100, 163, 165–166, 191, 199, 201 Coating, 25, 30–32, 51, 54, 94, 101, 142, 162 Cold metal transfer (CMT), 126 Cold spray, Cold spray additive manufacturing (CSAM), 12, 14, 16, 22, 23, 27, 33, 60, 93, 116, 117 Complete melting, 32, 51, 100 Complexity, 9–11, 45, 85, 177, 188, 190, 192–194, 199 Complex part, 10, 90, 152, 154, 163, 182, 183, 188, 189, 192, 202 Composite, 3, 14, 15, 51, 54, 104, 105, 117, 193 Composite extrusion modeling (CEM), 126, 128 Continuous liquid interface production (CLIP), D Degradation, 9, 84 Digital light processing (DLP), 12, 22 Directed energy deposition (DED), 1–3, 12, 24–28, 30, 94 Drilling, 1, 10, 189, 192, 201 E Electrochemical additive manufacturing (ECAM), 12, 14–16, 22, 24, 27 Electrode, 12, 66, 150, 151, 156 Electron beam (e-beam), 70, 74 Electron beam melting (EBM), 3, 12, 14, 16, 22–24, 27–32, 42, 43, 59, 70, 85 Electron welding, 3 Energy-efficient, 84, 100, 175, 180 Evaporation rate, 77 F Fabrication rate, 54–59, 175 Feeding, 30–32, 36, 37, 45, 46, 105, 107, 174 Feedstock, 9, 24, 25, 29–34, 93, 94, 103–108, 113, 170, 177, 179, 181, 188, 189 Filament, 12 Four-dimensional printing (4DP), 142, 143 Friction stir additive manufacturing (FSAM), 181–182 Friction stir processing (FSP), 113 Friction stir welding (FSW), 4, 181 Full melting, 3, 14, 44, 46, 51, 54 Functionally graded materials (FGM), 16, 195 Fused deposition modelling (FDM), 11, 12, 15, 22, 24, 27, 30, 37, 126, 127, 142, 143, 152, 155, 164–165 Fused pellet modeling (FPM), 126, 127 Future process, 190 G Gas metal arc welding (GMAW), 119 Gas tungsten arc welding (GTAW), 119, 122 H High energy beam, 23, 25, 42, 75, 106, 107, 128, 129, 181 High speed, 59, 82–84, 117 High speed sintering (HSS), 12, 14, 22, 32, 42, 43, 82–86 Hoppers, 196, 197 Hybrid manufacturing, 178–180, 184 I Infiltration, 14, 15, 53, 88, 195 Inhibiter, 43, 83, 90 Ink jet printing (IJP), 12, 22 K Kinetic energy, 23, 29, 75, 117 L Laminated object manufacturing (LOM), 173–175, 177 Laser energy density, 48, 49, 59 Laser engineered net shaping (LENS), 12, 14–16, 22, 23, 27–30, 33, 60, 93, 94 Layer thickness, 49, 50 Layer-less FDM, 164 Layerwise scanning, 86 Linewise scanning, 59, 85, 87 Liquid deposition, 33 Liquid deposition process (LDP), 35 Lithography based ceramic manufacturing (LCM), 12 Localized microwave heating based AM (LMHAM), 12, 22 Low temperature, 23, 29, 101 M Machining, 1, 7–11, 61, 102, 162, 166, 174, 177, 178, 180, 181, 183, 184, 189, 191, 192, 201 Magnetic field, 68–72 Material bed process, 32, 36, 37, 188–190 Material deposition process, 36, 37 Melt pool, 48, 52, 58, 97–100, 104–106, 112 Metal powder, 14, 29, 75 Micro droplet deposition manufacturing (MDDM), 13, 22 Microheater array powder sintering (MAPS), 13, 22 Microwave energy, 29, 80, 81 Multi-functional, 195, 196 Multi-material, 150, 193, 195–198 N Non-layer, 37 O Orientation, 7, 57, 61, 152, 154, 163, 166, 176, 199, 200 Overhangs, 9, 52, 100, 192, 198, 199 P Partial melting, 3, 14, 32, 44, 50, 52–54, 73, 117 Photopolymer, 12, 13, 15, 23, 25, 28, 30–34, 140, 165, 167–169, 178, 188, 189, 191 Photopolymer bed process (PPBP), 132–143 Photopolymer jetting (PJ), 13, 22 Plasma arc additive manufacturing (PAD), 13, 22 Plasma transferred arc, 124 Plasma welding, 4 Pointwise scanning, 59, 85, 87, 88 Porosity, 16, 48, 52, 74, 77, 111, 112, 167, 181, 188, 191, 198 Index205 Post-processing, 8, 13, 14, 43, 50, 53, 81, 88–90, 140, 142, 143, 162, 177, 190, 192 Powder bed fusion (PBF), 3, 9, 24–26, 32, 42, 43, 56, 60, 61, 80, 82, 183–184, 193–194, 199 Powder bed process (PBP), 41, 139, 188 Powder deposition, 12, 33, 94–101, 193, 194, 196, 198 Powder melt extrusion (PME), 126, 128 Production, 44, 48, 49, 52, 54, 70, 73, 74, 77, 78, 84, 85, 97, 112, 114, 163, 166–168 Q Quadrupole, 72 R Rapid freeze prototyping (RFP), 13, 22, 132, 138 Repair, 60, 101, 102, 162–163 S Scan speed, 48, 52, 53, 56, 58, 59, 69, 70, 76, 77, 101, 112 Selective heat sintering (SHS), 13, 15, 22, 42, 81 Selective inhibition sintering (SIS), 13, 42, 43, 89, 90 Selective laser melting (SLM), 3, 13–16, 22, 23, 27–32, 42, 43, 46, 48, 74–77, 85, 140 Selective laser sintering (SLS), 3, 13–16, 22, 23, 27–32, 42–46, 51, 83–85, 140 Sheet, 27, 171–184 Sheet based process (SBP), 178, 181 Sheet lamination, 27 Slurry bed process, 139, 140 Slurry deposition, 13, 35, 139–141 Small feature, 128, 129, 183 Solid bed process, 189 Solid deposition, 33, 35, 112–116 Staircase effect, 160, 162, 165, 168 Stereolithography (SL), 1, 2, 4, 8, 12, 13, 15, 22–29, 31, 132, 134, 135, 142, 143, 166, 169, 178 Subtractive manufacturing, 177, 180 Support structure, 57, 100, 162, 165 Surface roughness, 30, 49, 51–53, 57, 74, 75, 77, 117, 191 Sustainability, 56, 189 T Thermal lamp, 43, 82–84, 86 Thermoplastic 3D printing (T3DP), 13, 22 3D gel printing (3DGP), 13, 22, 23, 33 Three-dimensional printing (3DP), 88, 143 Tooling, 2, 5, 177 Top-down approach, 7 Tungsten electrode, 122–124 Two-photon polymerization (2PP), 13, 15, 22, 30, 37, 163, 168–170 U Ultrasonic consolidation (UC), 27, 172, 180, 181, 184 V Vacuum, 14, 65, 68, 72–74, 77, 104 Vat photopolymerization, 13, 28 W Waste, 8, 53, 90, 174, 189 Water bed process, 189 Wire arc additive manufacturing (WAAM), 13, 14, 22, 23, 27, 30, 33, 93 Wire deposition, 33 Wire feeding, 30–32, 105–107
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