مشروع تخرج بعنوان The Optimization Model of Composite Pin Fins

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مشروع تخرج بعنوان
The Optimization Model of Composite Pin Fins
مع ملف عرض المشروع

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CHAPTER 1 INTRODUCTION 1
1 1 INTRODUCTION 1
1 2 MOTIVATION AND BACKGROUND 3
1 3 NEED FOR RESEARCH 3
1 4 OVERLOOK TO THERMALLY CONDUCTIVE COMPOSITES 5
1 5 HIGH THERMAL CONDUCTIVITY POLYMER MATRIX COMPOSITES 7
Polymer Matrix 9
Carbon fibers 12
1 6 ENHANCED THERMAL CONDUCTIVITY POLYMERIC MATERIALS 14
CHAPTER 2 HEAT TRANSFER THROUGH EXTENDED SURFACES 15
2 1 INTRODUCTION 15
2 2 OVERLOOK TO HEAT TRANSFER 15
Conduction 15
Convection 15
Radiation 16
2 3 HEAT TRANSFER THROUGH FINS 16
Overlook to fins 16
Industrial applications of fins 17
Fin materials 18
Fin configurations 19
Heat sink selection methodology in electronic cooling 21
Rules for choosing or designing a heat sink 21
Basic Types of fins 23
Fin manufacturing technique 27
2 4 DEFINING TERMS 28
CHAPTER 3 LITERATURE REVIEW 31
3 1 INTRODUCTION 31
3 2 RECENT RESEARCHES 31
3 3 HEAT TRANSFER IN FINS, AND COMPLEX, DIFFERENT GEOMETRIES 35
3 4 ELECTRONIC PACKAGING 35
3 5 HEAT TRANSFER ENHANCEMENT 35
CHAPTER 4 THERMAL PERFORMANCE AND OPTIMIZATION OF NATURAL
CONVECTION PPS COMPOSITE PIN FIN HEAT SINKS 36
4 1 INTRODUCTION 36
4 2 FEA BASIC CONCEPTS OF MODELLING USING FEA 36
Why FEA? 37
Finite Element Applications in Engineering 38
FEA with ANSYS Icepack 39
A General Procedure for FEA 41
Benefits of simulation modeling and analysis: 42
4 3 WATER COOLED NATURAL CONVECTION PPS PIN FIN 43
Building the model 43
Generate Mesh 45
Boundary conditions and loads 45
Solution Procedure 48
Results and discussion 54
4 4 THERMAL PERFORMANCE OF NATURAL CONVECTION PPS INLINE PIN FIN HEAT SINKS 54
Cabinet modelling 55
Motherboard PCB modelling 56
CPU assembly modelling 57
Capacitors modelling 57
Heat sink modelling 58
Generate mesh 58
Meshing steps 59
Solution procedure 61
Results and post processing 64
4 5 INLINE AND STAGGERED HEAT SINK CONFIGURATION 66
4 6 HEAT SINK OPTIMIZATION 68
Optimization procedure 68
Defining the design variables and constraints 68
Effect of fin radius (1 5 – 1 8mm) on thermal resistance 70
Effect of fin height (3 – 6cm) on thermal resistance 70
Effect of number of fins in row (6 – 12) on thermal resistance 71
Effect of array heat transfer coefficient (ha) on fin height 71
Effect of mass based heat transfer coefficient (hm) on fin height 73
Effect of space-claim heat transfer coefficient (hsc) on fin height 74
4 7 DEFINING TERMS 74
Array heat transfer coefficient, ha 74
Thermal resistance, Rhs 75
Mass Based Heat Transfer Coefficient, hm 75
Space claim heat transfer coefficient, hsc 75
4 8 PIN FIN EQUATIONS 76
4 9 PIN FIN ARRAY ANALYSIS WITH FIN DENSITY 79
Numerical results substantiate analytical modeling results for heat sinks within
the Aihara et al [45] fin density range 80
CHAPTER 5 CONCLUSION 82
5 1 INTRODUCTION 82
5 2 OPTIMUM PIN FIN RADIAL THERMAL CONDUCTIVITY VALUE 83
5 3 PPS COMPOSITE PIN FIN NATURAL CONVECTION HEAT SINK THERMAL PERFORMANCE 83
5 4 PPS COMPOSITE PIN FIN FORCED CONVECTION HEAT SINK THERMAL PERFORMANCE 84
5 5 NOTES ON RESULTS 84
5 6 FUTURE SCOPE 85
Anisotropic Pin Fin Modeling 85
Mechanical strength 85
REFERENCES……… 86
MODELLING AND OPTIMIZATION OF POLYMER COMPOSITE PIN FIN 90
APPENDIX A PHYSICAL PROPERTIES OF VARIOUS MATERIALS 105
APPENDIX B MECHANICAL PROPERTIES OF VARIOUS MATERIALS 108
APPENDIX C TYPICAL PROPERTIES OF REINFORCING FIBERS 110
Figure 1 1 PPS composite staggered pin fin array [4] 4
Figure 1 2 Formation of a composite material using fibers and resin 5
Figure 1 3 Continuous fiber and short fiber composites 8
Figure 1 4 Schematic illustration of polymer chains 9
Figure 1 5 Polymer chains in (a) amorphous (b) semi-crystalline polymer [20] 10
Figure 1 6 Longitudinal thermal conductivity of carbon fiber filled composite [21] 11
Figure 1 7 Carbon fiber volume consumption and prices [17] 14
Figure 2 1 A finned heat sink and fan assembly (left) and microprocessor (right) 17
Figure 2 2 Fin configurations (a) Straight fin of uniform cross section (b) Straight fin of
non-uniform cross section (c) Annular fin (d) Pin fin 19
Figure 2 3 Plate fin terminology 20
Figure 2 4 Inline pin fin terminology 20
Figure 2 5 Various types of heat sinks 21
Figure 2 6 Plate fin heat sinks 23
Figure 2 7 Cold-forged round-pin heat sinks 24
Figure 2 8 Cold-forged elliptical pin heat sinks 25
Figure 2 9 Cross-cut aluminum heat sink 26
Figure 2 10 Fin array (a) Fins are integral with the base (b) Fins are attached to the base27
Figure 2 11 Extruded straight fin heat sink 27
Figure 4 1 Objects built with simple and small pieces: (a) A fire engine built with LEGO;
and (b) A house built with many elements—bricks, beams, columns, panels 37
Figure 4 2 A sketch of the computer-aided product development process 38
Figure 4 3 Velocity streamlines colored by fan for a card array in a VME format box cooled
by 3 axial fans, image created using ANSYS CFD-Post 40
Figure 4 4 A plate with a hole (CAD model); and (b) A FEM discretization (mesh) 41
Figure 4 5 Top view of PPS composite pin fin 43
Figure 4 6 Rectangular dimensions 45
Figure 4 7 Defining array parameter HF 46
Figure 4 8 Heat transfer coefficient table 46
Figure 4 9 Applying convection load 47
Figure 4 10 Temperature contour of the fin 48
Figure 4 11 Defining path to obtain temperature distribution 0 5 cm above the fin base 49
Figure 4 12 First point of path low TC 49
Figure 4 13 Second point of path low TC 50
Figure 4 14 Defining path to obtain temperature distribution 3 5 cm above the fin base 50
Figure 4 15 First point of path Mid TC 50
Figure 4 16 Second point of path Mid TC 51
Figure 4 17 Defining path to obtain temperature distribution 7 5 cm above the fin base 51
Figure 4 18 First point of path TOP TC 51
Figure 4 19 Second point of path TOP TC 52
Figure 4 20 Numerical temperature distribution at PPS composite pin fin locations 53
Figure 4 21 Validation curve for a heat transfer rate of 27 4 W (kz= 13 W/m K, Kr= 2 W/m K)
Figure 4 22 Schematic illustration of the 3D chassis model 55
Figure 4 23 Cabinet boundary conditions 56
Figure 4 24 Meshing parameters 59
Figure 4 25 Top view of 3D chassis meshing 60
Figure 4 26 Isometric view of 3D chassis meshing 60
Figure 4 27 Basic parameters specification 63
Figure 4 28 Basic settings of solution 63
Figure 4 29 Temperature contour using PPS heat sink (k=20 W/mK) 64
Figure 4 30 Temperature contour using copper heat sink (k=400W/mK) 65
Figure 4 31 Temperature contour using aluminum heat sink (k=200W/mK) 65
Figure 4 32 Temperature variation along axial distance of the pin fin 66
Figure 4 33 Temperature contour for inline PPS heat sink 66
Figure 4 34 Temperature contour for staggered PPS heat sink 67
Figure 4 35 Cooling rates of staggered and inline pin fin configuration 67
Figure 4 36 Parameters and optimization settings 69
Figure 4 37 Effect of Pin Fin Radius on Thermal Resistance 70
Figure 4 38 Effect of Pin Fin Height on Thermal Resistance 70
Figure 4 39 Effect of number of fins on thermal resistance 71
Figure 4 40 Natural Convection Array Heat Transfer Coefficient Variation with Fin
Conductivity and Height – Optimally Spaced Fins (L= 0 1m, W = 0 1m,
θb=25K) 72
Figure 4 41 Mass-specific heat transfer coefficient variation with pin fin height, thermal
conductivity and diameter for aluminum and PPS heat sinks 73
Figure 4 42 Pin fin hsc for enhanced PPS and aluminum in natural convection 74
Figure 4 43 Staggered pin fin heat sink 76
Figure 4 44 Enhanced PPS pin fin ha variation with fin density in natural convection 80
Figure 4 45 Enhanced PPS hm variation with fin density in natural convection 81
Table 1 1 Polymer composite properties 2
Table 1 2 Thermal conductivity of various composites 6
Table 1 3 Advantages/disadvantages of PMC’s 7
Table 1 4 Thermal conductivity of various materials 8
Table 1 5 Characteristics of amorphous polymers 10
Table 1 6 Recommended polymers for heat exchanger applications [106, 107] 11
Table 1 7 Selection criteria for polymer resins 12
Table 1 8 Thermal properties of pitch based carbon fiber [1] 13
Table 2 1 Advantages and limitations of fins 18
Table 4 1 Examples of engineering applications using FEA 39
Table 4 2 Dimensions of the specimen 44
Table 4 3 Fin material properties 44
Table 4 4 Temperature measurement (numerical results) from path Low TC, Mid TC, Top
TC at 27 4W 52
Table 4 5 Cabinet dimensions 55
Table 4 6 Motherboard PCB Modelling 56
Table 4 7 Physical properties of FR-4_Ref Material 56
Table 4 8 CPU cabinet dimensions 57
Table 4 9 Socket dimensions 57
Table 4 10 Capacitors dimensions 57
Table 4 11 Physical properties of the ceramic material 57
Table 4 12 Heat sink dimensions 58
Table 4 13 Physical properties of PPS material

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